Originally Posted by Matt Cramer
(Post 243877)
It's easy to double the size of the V3.0 if you tried adding everything to it, which is why I suggested a daughterboard in the lid. Another thing is that you'd definitely need approval from B&G to sell something that copies the base circuits. I'm not sure what they would say but I am pretty sure they'll expect you to support it throughly at the very least.
Originally Posted by Matt Cramer
(Post 243877)
A daughterboard would require no such authorization.
Originally Posted by Matt Cramer
(Post 243877)
You might want to see the MS-III discussion for some comments on case size and what might be done about it.
Originally Posted by elesjuan
I'm just speaking from my personal experience with this, but adding onto an existing board with daughter boards has too much possibility for problems.
That said, daughterboards can be made perfectly reliable. The key is to use a proper pass-through connector designed specifically for stacking, and to provide standoffs for securing the board, rather than relying upon the connector(s) to support the load of the board. Something caught my eye over at DIYEFI, in the "Letting go of the "MegaSquirt mindset" (hardware)" thread: Another area that I don't like is the complexity of configuration. This exists because of the attitude present that says "we must support all cars ever made", and "we must do it on a single board" The problem that DIYEFI is going to have is that there are too many chefs stirring the soup. MS got off the ground because B&G designed it, standardized it, and guided its evolution. I don't agree with every decision they made, but they did a good job of keeping it on track. |
We've been thinking about a way to get a daughterboard on existing Megasquirts without the pick-up point issues, and it's close to some of the approaches mentioned here. Right now it's just an idea being kicked around, but it sure sounds like there may be a demand for it.
Form factor hasn't been discussed on the MS-III forum as much as feature sets, but there's been some mention of it. The MS-III is likely to be B&G's official device for people who want a LOT of outputs, but there may be room for something between that and the existing V3.0. |
I don't seem to understand the legal issue regarding modifying the MS-II design. Just because they use a certain voltage divider ratio to read a sensor doesn't mean you can't use that same ratio. There are only so many circuits that will do what we need in terms of breaking out CPU I/O to usable automotive signals. I don't see any reason why we can't adapt their board to do out bidding.
I think of it kinda like patents. You can't go and directly copy a device and sell it as your own, but you are free to improve upon current devices. I don't see why we can't do the same thing. (I'm probably wrong though, I'm a naive 21 year old) |
Sorry for the late bump, just came across this looking through some statistics...
Originally Posted by Joe Perez
(Post 243114)
Too hackish. I respect what they're doing, but they're just going way too apeshit over processing power and ten thousand I/O pins.
By the time they get that code stable we'll have a black Jewish lesbian in the white house. By the time they get that code functional we'll have a black Jewish lesbian in the white house. Fred. |
Joe-- What you're looking for, from what I can see, will be there in the MS3. These are all good points though, and a preliminary feature list should be posted soon based on user input and feasibility (but it's a healthy list). We'd love your input on what's missing, not just in features, but in bringing in all together and making sure nothing's missed in the details...
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